Ceramic Chip And Dip

INDEX BY DEVICE TYPE OF REGISTERED CARRIER OUTLINES (CO ...
Ceramic Chip Carrier Coinstack TapePak® Magazine Family, Metal, Coinstack CO-019 Plastic Magazine Family, Coinstack CO-021 Plastic Magazine Plug Family CO-022 TapePak® Plug Family, Coinstack Magazine CO-023 Dual In-Line (DIP) 7.62mm .300 Row Spacing Magazine Family, (DIP), CO-001 TO-220 Magazine CO-002 ... View This Document

Chip Resistors & Arrays - Bourns
Chip Array • Ceramic has protective coating on top • Terminate to metallization on ceramic • Low power DIP Package • Ceramic covered with molding •CR 0201 - F - 252 E LF Terminate to pins connected to ceramic • Higher power rating than chip array HOW TO ORDER - THICK FILM CHIP ARRAYS CA T 10 - 103 4 LF ... Document Viewer

General Multilayer Ceramic Capacitors - Sphere.bc.ca
1 Samsung Multilayer Ceramic Capacitor Dip Time 3±0.3 sec. 5±0.5 sec. Pre-heating at 80~120℃for 10~30 sec. RELIABILTY TEST CONDITION. General Capacitors NO ITEM PERFORMANCE TEST CONDITION 13 Humidity (Steady ... Retrieve Here

Untitled Document [ecee.colorado.edu]
Available in windowed ceramic DIP packages, as well as plastic one time programmable (OTP) PDIP and PLCC packages. Data can be typically accessed in less than 55 ns, al-lowing high-performance microprocessors to operate without any WAIT states. The device offers separate Output Enable (OE#) and Chip Enable (CE#) controls, ... Retrieve Doc

Yageo Wireless Components & Decision Tree
Wireless Communications Overview Chip antenna (Ceramic (majority) or FR4) Patch antenna (Ceramic) Working Freq ceramic body. High thermal-conduction and environmental resistance. 1) circular polarization, highly direction antenna. high positioning accuracy ... Return Doc

Shock Severity Limits For Electronic Components Revision D By ...
Shock Severity Limits for Electronic Components Revision D By Tom Irvine Email: tom@vibrationdata.com (DIP) 1.26 DIP with side-brazed lead wires . 11 (PGA) with many wires extending from the bottom surface of the PGA 2.25 Surface-mounted leadless ceramic chip carrier (LCCC). A ... Read Document

Effect Of Thermal Shock Conditions On Reliability Of chip ...
Effect of thermal shock conditions on reliability of chip ceramic capacitors Alexander Teverovsky Dell Services Federal Government, Inc. Code 562, NASA GSFC, Greenbelt, MD 20771 Alexander.A.Teverovsky@nasa.gov Abstract Different size X7R MLCCs have been subjected to three types of thermal shock testing: terminal solder pot dip test, ... Fetch Content

Dual Inline Package (DIP) CERDIP / PDIP Small Outline (SO) SOT / SOIC / TSSOP Quad Flat Package (QFP) Quad Flat No-leads (QFN) Multi-row QFN / TQFN Stacked BGA Flip Chip/Wire Interconnect Ball Grid Array (BGA) CBGA / PBGA / FPBGA 1950 2013 TO-92 Metal Cans Ceramic Side-brazed DIP CerDIP ... Document Viewer

TAXIchipTM Integrated Circuits - UChicago Particle Physics
D = 28-Pin Ceramic DIP (CD 028) L = 28-Pin Ceramic Leadless Chip Carrier (CL 028) DEVICE NUMBER/DESCRIPTION Am7968 – TAXIchip Transmitter (Local Mode only) Am7969 – TAXIchip Receiver (Local Mode only) AM7968 AM7969 /L K Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local ... Document Viewer

MPY100 MULTIPLIER-DIVIDER
HIGHLY RELIABLE ONE-CHIP DESIGN DIP OR TO-100 TYPE PACKAGE DESCRIPTION The MPY100 multiplier-divider is a low cost preci-sion device designed for general purpose application. In addition to four-quadrant multiplication, it also TO-100 and DIP ceramic packages. ... Get Doc

Packaging For MEMS - University Of California, Berkeley
Packaging for MEMS C. 2000 Kirt Williams BSAC Seminar, Oct. 2000 Packaging for MEMS Kirt R. Williams, Ph.D. Member of the Technical Staff DIP plastic 35 PGA ceramic 20 Leadless chip carrier ceramic 13 Leadless chip carrier plastic 28 Heat Transfer. Packaging for MEMS ... Fetch Content

AVX Ultimate Guide To Enhanced And High Reliability Components
CAPABILITY GUIDE - ENHANCED AND HIGH RELIABILITY COMPONENTS • Radial, Axial and 2 Pin DIP • Voltages up to 100Vdc • Supports multiple rework passes in ceramic chip carrier packaging applications • Excellent reliability ... View Document

3.2mmx1.6mm SMD CHIP LED LAMP
3.2mmx1.6mm smd chip led lamp preliminary spec attention observe precautions for handling electrostatic discharge sensitive devices part number: apt3216qwf/d white features z 3.2mmx1.6mm smt led, 0.75mm thickness. z low power consumption. z wide viewing angle. z ideal for backlight and indicator. z various colors and lens types available. ... Fetch Content

Dec 9, 2005 - Digi-Key
Multilayer Ceramic Chip Capacitors 10type (EIA 0402) (P/N : ECJ0EX1C104K) Individual Specification Dip the specimen in solder so that both terminal electrodes are completely submerged. Use solder H63A(JIS-Z-3282). For the flux use Dec 9, 2005 Note ; CLASSIFICATION SPECIFICATIONS No. ... Read Here

Throwing / Making A Pottery Double Serving Platter On The ...
Throwing / Making a Pottery Double Serving Platter on the Wheel. Usually used for Chips n Dips you could use it for serving different items dependant on the design. Make a bigger bowl in the ... View Video

˘ ˇˆ ˇ ˇ ˙˝ˇ˛ - Adafruit Industries
‡ chip forms are tested at ta = 25°c only. tlv2464m/am/q/aq and tlv2465m/am/q/aq available options packaged devices ta viomax at 25°c small outline† (d) small outline† (pw) ceramic dip (j) chip carrier (fk)-40°c to 125°c 2000 µv tlv2464qd tlv2465qd tlv2464qpw tlv2465qpw — — — — 1500 µv tlv2464aqd tlv2465aqd tlv2464aqpw ... Fetch Full Source

Intel 80286 - Wikipedia
An Intel A80286-8 processor with a gray ceramic heat spreader. Produced: From 1982 to 1991 The Intel 80286 had a 24-bit address bus and was able to address up to 16 Intel 80286 CPU Information, including chip errata and undocumented behaviour ... Read Article

MURATA PRODUCT Lineup Guides - Чип и Дип
MURATA PRODUCT Lineup Guides Application Guides Mobile Phones Selection Guides Personal Computers Televisions Capacitors Selection Guide of Chip Monolithic Ceramic Capacitors 03 For more information, please ask for catalog shown above or visit our website. ... Access Content

A Complete Sampling ADC 12-Bit 200 KSPS AD678
Ceramic DIP, and 44-lead J-leaded ceramic surface mount packages. Screening to MIL-STD-883C Class B is also available. by combining a high speed sample-hold amplifier (SHA), ADC, 5 V reference, clock and digital interface on a single chip. This provides a fully speci-fied sampling A/D ... Document Viewer

Conformal Coating - Wikipedia
The chip and the wire are delicate, so they are encapsulated in a version of conformal coating called "glob top." Conformal Coating Dip System. This coating is a highly repeatable process. If the printed circuit board (PCB) is designed correctly, ... Read Article

AD9501 Digitally Programmable Delay Generator
0°C to +70°C in a 20-pin plastic DIP, 20-pin ceramic DIP, and a 20-lead plastic leaded chip carrier (PLCC). Devices fully compliant to MIL-STD-883 are available in ceramic DIPs. Refer to the Analog Devices Military Products Databook or current AD9501/883B data sheet for detailed specifications. ... Content Retrieval

WLCW 2520 SMD Wire Wound Ceramic Chip Inductors
Approval sheet Page 1 of 6 ASC_WLCW2520 Series_V2.0 Sep. 2015 WLCW 2520 SMD Wire Wound Ceramic Chip Inductors *Contents in this sheet are subject to change witho ut prior notice. ... Retrieve Full Source

Ceramic Filters ('CERAFIL')/Ceramic Discriminators For ...
Ceramic Filters (CERAFILr)/ Ceramic Discriminators for Communications Chip type is only applied for SF series. Expressed by three-digit alphanumerics. (CERAFILr)/Ceramic Discriminators for Communications Equipment ... Doc Viewer